Printed Circuit Assembly Services
– Through Hole
– Surface Mount
– Mixed Assemblies
– Fine Pitch
– Components One Side
– Components Two Side
Automated Assembly Capabilities
Through Hole Technology
– Discrete Components (2 leaded)
– Discrete Components (3+ leaded)
– Dual-in-lines (.3ls to .6ls)
– Pin-grid Arrays
– Electronic Multi-leaded Components
Surface Mount Technology
– Standard Chip Components
– Cylindrical Components (MELF’s)
– Fine Pitch Automated Assemblies
Other Services
– Consignment Services
– Purchasing Services/Turnkey
– Cable Harnesses
– Connector Assemblies
– Wire Sets
– Wire Hot Stamping
– Mechanical Assemblies
– Electro Mechanical Assemblies
Types of Assembly Operation
– Prototype
– Medium Volume
– High Volumes
Facility Capabilities
– Automated Cleaning
– Automated Function Testing
– Automated In-circuit Test
– Conformal Coating
– Ultrasonic Welding
– Hand Soldering
– Hot Air Reflow
– Wave Soldering
– Encapsulation Potting
Testing
– Test Development
– Testing (Apart From Assembly)
– Test Equipment Design & Fabrication
– In-circuit Testing
Additional Services
– Assembly Burn-in
– System Build
– Repair/Refurbishment